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Jobs - Engineering Email A Friend Project Engineering Master’s Degree or higher in Material Science Engineering / Chemical Engineering / Mechanical Engineering or relevant disciplines Minimum 1 year’s working experience / research experience in semiconductor or packaging processes Good knowledge in packaging materials and packaging technologies Experience in packaging failure analysis would be an advantage Responsible for improving current packaging processes and developing new packaging technologies Attractive salary and fringe benefits package will be offered to the right candidates. Interested parties please submit your application through our company website: http://www.asmpacific.com/asmpt/career_post_hk.aspx Please visit our company website for our company background, products and other useful information. Website : http://www.asmpacific.com Data collected will be used for recruitment purpose only. Suitable candidates may be referred to other vacancies within our company.